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    Ethernet Phy Board

    Ethernet Phy Board

    Ethernet Phy Board
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    SFP Board

    SFP Board

    SFP Board

    .12 Port
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    SD Card

    SD Card

    SD Card
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    MIPI D-PHY Board

    MIPI D-PHY Board

    MIPI D-PHY Board

    MIPI TX PORT *1 (MIPI PHY CHIP MC20902)
    MIPI RX PORT *1 (MIPI PHY CHIP MC20901)

    Reserve IO *79 (Directly connected to FPGA) Reserve IO *24 (Connected to FPGA through Level Shifter, can be set to 1.8V, 2.5V, 3.3V) Total Reserve IO *103

    Reserve 5V Power: 2 Pin Header
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    Bridge Board

    Bridge Board

    Bridge Board
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    Loopback Card

    Loopback Card

    Loopback Card

    Self-diagnostic program includes:
    .System BOOT detection
    .Voltage detection
    .I/O detection
    .GTY I/O testing
    .HP I/O testing
    .DDR4 SODIMM testing
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    FPGA ARM based SOC module : TXZ-1300

    FPGA ARM based SOC module : TXZ-1300

    /* 聯豪科創 統一產品頁面設計規範 */
    .tp-product-page { color: #333; font-family: "Segoe UI", "Roboto", "PingFang TC", sans-serif; line-height: 1.7; }
    .tp-main-color { color: #0d1735; }
    .tp-section { padding: 60px 20px; max-width: 1200px; margin: 0 auto; }

    /* Hero Header - 深藍科技漸層 */
    .tp-product-hero { background: linear-gradient(135deg, #0d1735 0%, #000 100%); color: #fff; padding: 80px 20px; text-align: center; border-radius: 0 0 50px 50px; }
    .tp-product-hero h1 { font-size: 42px; margin-bottom: 15px; font-weight: 800; letter-spacing: 1px; }
    .tp-product-hero p { font-size: 18px; opacity: 0.9; max-width: 800px; margin: 0 auto; font-style: italic; }

    /* Feature Grid - 俐落三欄式佈局 */
    .tp-feature-grid {
    display: grid;
    grid-template-columns: repeat(3, 1fr);
    gap: 30px;
    margin: 40px 0;
    }
    .tp-feature-item { text-align: center; padding: 30px 20px; background: #fdfdfd; border: 1px solid #eee; border-radius: 12px; transition: 0.3s; height: 100%; box-sizing: border-box; }
    .tp-feature-item:hover { box-shadow: 0 10px 30px rgba(0,0,0,0.08); transform: translateY(-5px); }
    .tp-feature-item i { font-size: 40px; color: #0d1735; margin-bottom: 15px; display: block; }
    .tp-feature-item h3 { font-size: 18px; color: #0d1735; margin-bottom: 12px; font-weight: 700; }

    /* Tech Highlights Section */
    .tp-highlight-content { background: #f4f7fa; padding: 40px; border-radius: 20px; margin-bottom: 50px; }
    .tp-list { list-style: none; padding: 0; }
    .tp-list li { position: relative; padding-left: 30px; margin-bottom: 15px; font-size: 16px; }
    .tp-list li::before { content: "✔"; position: absolute; left: 0; color: #0d1735; font-weight: bold; }

    /* Specification Table */
    .tp-spec-container { overflow-x: auto; margin-top: 40px; }
    .tp-spec-table { width: 100%; border-collapse: collapse; background: #fff; min-width: 600px; }
    .tp-spec-table th { background: #0d1735; color: #fff; padding: 15px; text-align: left; font-size: 18px; }
    .tp-spec-table td { padding: 12px 15px; border-bottom: 1px solid #eee; font-size: 15px; }
    .tp-spec-table tr:nth-child(even) { background: #fafafa; }
    .tp-spec-label { font-weight: 600; color: #0d1735; width: 30%; }

    /* CTA Section */
    .tp-cta-box { background: #0d1735; color: #fff; padding: 50px; text-align: center; border-radius: 20px; margin-top: 60px; }
    .tp-cta-btn { display: inline-block; background: #fff; color: #0d1735 !important; padding: 15px 40px; border-radius: 50px; text-decoration: none; font-weight: 700; margin-top: 25px; transition: 0.3s; }
    .tp-cta-btn:hover { background: #000; color: #fff !important; transform: scale(1.05); }

    /* RWD */
    @media (max-width: 992px) {
    .tp-feature-grid { grid-template-columns: repeat(2, 1fr); }
    }
    @media (max-width: 600px) {
    .tp-feature-grid { grid-template-columns: 1fr; }
    .tp-product-hero h1 { font-size: 30px; }
    }




    TXZ-1300

    Empowering Large-Scale SoC Innovation with Scalable Capacity and Intelligent Control.

    融合 ARM 雙核實力與 FPGA 靈活邏輯,為嵌入式驗證提供高性能、高密度的異構運算核心。







    All Programmable SoC

    搭載 XC7Z020,無縫整合 ARM Cortex-A9 雙核心與可程式化邏輯,實現軟硬體協同優化。




    Fast-to-Market

    預先整合高容量 DDR3 與 GbE 通訊介面,省去繁瑣的主板開發,顯著縮短原型驗證上市時程。




    High-Density I/O

    多達 123 組可自定義 User I/O,支援 55 組 LVDS 差分對,提供極佳的系統擴展彈性。




    定義嵌入式運算的靈活與強悍

    TXZ-1300 是一款專為追求高整合度與低功耗設計的 SoC 模組。透過 Xilinx Zynq-7000 架構,它不僅能處理複雜的作業系統任務,還能同時執行硬體級的實時信號處理,是構建現代邊緣計算設備的核心首選。


    高速訊號整合 (High-speed signal integrity): 透過精密佈線與阻抗控制,確保 1GB DDR3 與 GbE 在高速運行下的數據完整性。
    縮短上市時程 (Time-to-market): 提供模組化設計與雙重板對板連接器(Board-to-board),讓團隊能快速開發自定義載板,降低部署風險。
    完善的通訊資源: 內建 USB 2.0、GbE 與 USB-UART,滿足從基礎調試到大規模數據傳輸的多樣化通訊需求。
    開發者友善設計: 具備 JTAG 偵錯口、用戶 LED 與按鈕,支援標準開發流程,大幅提升研發效率。



    Technical Specifications





    TXZ-1300 Hardware Resources




    SoC Core
    Xilinx Zynq-7000 (XC7Z020-1CLG400C)


    Processor System (PS)
    Dual-core ARM Cortex-A9


    Internal Memory
    1GB DDR3 SDRAM / 128Mb QSPI Flash


    Communications
    10/100/1000 Ethernet / USB 2.0 / USB-UART


    User I/O Count
    123 Total (115 PL, 8 PS MIO)


    I/O Configuration
    Up to 55 LVDS Pairs or 115 Single-ended I/O


    Storage Expansion
    Micro SD Card Interface Supported


    Debug & Misc
    JTAG Port / User LED / Push Button






    Request Full Specifications

    Detailed datasheets and technical documentation are available upon request.
    Please contact our team for more information regarding the TXZ-1300
    Request Datasheet Now
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    FPGA ARM based SOC module : TXZ-1320

    FPGA ARM based SOC module : TXZ-1320

    /* 聯豪科創 統一產品頁面視覺框架 */
    .tp-product-page { color: #333; font-family: "Segoe UI", "Roboto", "PingFang TC", sans-serif; line-height: 1.7; }
    .tp-main-color { color: #0d1735; }
    .tp-section { padding: 60px 20px; max-width: 1200px; margin: 0 auto; }

    /* Hero Header - 採樣專家深藍漸層 */
    .tp-product-hero { background: linear-gradient(135deg, #0d1735 0%, #000 100%); color: #fff; padding: 80px 20px; text-align: center; border-radius: 0 0 50px 50px; }
    .tp-product-hero h1 { font-size: 38px; margin-bottom: 15px; font-weight: 800; letter-spacing: 1px; }
    .tp-product-hero p { font-size: 18px; opacity: 0.9; max-width: 900px; margin: 0 auto; font-style: italic; }

    /* Feature Grid - 三欄式佈局 */
    .tp-feature-grid { display: grid; grid-template-columns: repeat(3, 1fr); gap: 30px; margin: 40px 0; }
    .tp-feature-item { text-align: center; padding: 30px; background: #fdfdfd; border: 1px solid #eee; border-radius: 12px; transition: 0.3s; height: 100%; box-sizing: border-box; }
    .tp-feature-item:hover { box-shadow: 0 10px 30px rgba(0,0,0,0.08); transform: translateY(-5px); }
    .tp-feature-item i { font-size: 40px; color: #0d1735; margin-bottom: 15px; display: block; }
    .tp-feature-item h3 { font-size: 18px; color: #0d1735; margin-bottom: 12px; font-weight: 700; }

    /* Tech Highlights Section */
    .tp-highlight-content { background: #f4f7fa; padding: 40px; border-radius: 20px; margin-bottom: 50px; }
    .tp-list { list-style: none; padding: 0; }
    .tp-list li { position: relative; padding-left: 30px; margin-bottom: 15px; font-size: 16px; }
    .tp-list li::before { content: "✔"; position: absolute; left: 0; color: #0d1735; font-weight: bold; }

    /* Spec Table Style */
    .tp-spec-container { overflow-x: auto; margin-top: 40px; }
    .tp-spec-table { width: 100%; border-collapse: collapse; background: #fff; min-width: 600px; }
    .tp-spec-table th { background: #0d1735; color: #fff; padding: 15px; text-align: left; font-size: 18px; }
    .tp-spec-table td { padding: 12px 15px; border-bottom: 1px solid #eee; font-size: 15px; }
    .tp-spec-table tr:nth-child(even) { background: #fafafa; }
    .tp-spec-label { font-weight: 600; color: #0d1735; width: 35%; }

    /* CTA Section */
    .tp-cta-box { background: #0d1735; color: #fff; padding: 50px; text-align: center; border-radius: 20px; margin-top: 60px; }
    .tp-cta-btn { display: inline-block; background: #fff; color: #0d1735 !important; padding: 15px 40px; border-radius: 50px; text-decoration: none; font-weight: 700; margin-top: 25px; transition: 0.3s; }
    .tp-cta-btn:hover { background: #000; color: #fff !important; transform: scale(1.05); }

    /* RWD */
    @media (max-width: 992px) { .tp-feature-grid { grid-template-columns: repeat(2, 1fr); } }
    @media (max-width: 600px) { .tp-feature-grid { grid-template-columns: 1fr; } .tp-product-hero h1 { font-size: 28px; } }




    TPS-Z7020 Multi-Function Board

    Advanced Acquisition & Logic Control: Precision Sensing Meets Heterogeneous Computing.

    整合 16 通道數位化器與 LVDS 模式接收器,為晶片掃描測試與高速工業控制提供全方位的異構解決方案。







    16-CH High-Speed Digitizer

    內建 16 通道數位化器與靈活的 DIO 控制器,實現多點並行的高精度信號採集與處理。




    Algorithm Accelerator

    利用 Zynq-7020 的 85K 邏輯單元實現硬體加速,大幅提升實時信號分析與運算效能。




    LVDS Pattern Receiver

    板載 LVDS / mini LVDS 測試模式接收器,專為顯示介面驗證與高速序列數據接收設計。




    定義高密度的數據採集與邊緣控制

    TPS-Z7020 是一款專為複雜測試環境設計的多功能控制平台。透過 Xilinx Zynq-7000 SoC 架構,它將 演算法加速器 (Algorithm Accelerator) 與 網路存取控制 (Network Access) 封裝在超小尺寸的 PCB 空間內,不僅優化了 高速訊號整合 (Signal Integrity),更為工業 4.0 應用提供了極速的 上市時程 (Time-to-market) 優勢。


    多通道晶片掃描測試: 支援板載多通道 Chip Scan In/Out 測試,是半導體驗證與除錯的理想選擇。
    強大的存取資源: 配備 1GB DDR3 大容量緩存與 4GB eMMC 存儲,滿足大數據量採集的緩衝需求。
    彈性的 I/O 擴充: 提供多達 115 組 PL User I/O,支援各種自定義工業周邊介面對接。
    完善的網路連接: 整合 Gigabit Ethernet 與 USB 2.0 PHY,實現高效的遠端監控與數據回傳。



    Technical Specifications





    TPS-Z7020 Hardware Resources




    Core SoC
    Xilinx Zynq-7020 (XC7Z020-CLG400) | 85K Logic Cells


    Memory & Storage
    1GB DDR3 RAM | 4GB eMMC Flash


    Digitizer & I/O
    16 Channels Digitizer + DIO | Digital I/O Controller


    Signal Interface
    LVDS / mini LVDS Pattern Receiver on Board


    Test Capabilities
    Multi-channel Chip Scan In/Out Support


    Communications
    Gigabit Ethernet PHY | USB 2.0 PHY


    Functional Blocks
    Algorithm Accelerator | Network Access Controller


    User I/O Pins
    115 PL Pins | 10 PS MIO Pins


    Physical & Power
    101 x 57 mm Small Form Factor | 5V~12V Power In






    Request Full Technical Documentation

    Detailed datasheets, API SDKs, and hardware setup guides for TPS-Z7020 are available upon request.
    Please contact our technical team for more information regarding Data Acquisition & Control solutions.
    Contact Our Technical Team
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    Xilinx Zynq UltraScale+ MPSOC _ TPS-ZU5EV / ZU7EV SoM

    Xilinx Zynq UltraScale+ MPSOC _ TPS-ZU5EV / ZU7EV SoM

    Zynq® UltraScale+™ MPSOC 5EV / 7EV
    SPI flash memory (8 Mb)*1
    DDR4 256 Mb x 16 SDRAMs component memory (4 Gb) *4

    Size:116.8mm*152.4mm
    Operating Voltage: 12VDC